SMT step by step Step 8: Test/Inspection

摘要

The types of defects found on a modern PCB are broad. To understand the defect spectrum for different products against the potential to introduce defects across different manufacturing lines is very complex. There have been many changes in defects and inspection techniques over the past 15 years with many more expected. New assembly technologies such as lead-free solder will change the fault spectrum and possibly the defect types that must be detected. Increasing PCB data and clock speeds will reduce ICT bed-of-nails access and require increasing use of different and complementary inspection strategies such as AOI and AXI.