Selective Soldering of Through-hole Components

摘要

In today's mixed-assembly board, surface mount components represent the majority of all components. However, it is rare to see complete absence of through-hole components in most assemblies. In some cases, selective soldering can be avoided by using the paste-in-hole process for both surface mount and through-hole components. However, the paste-in-hole process is not always feasible. This happens when the component is temperature-sensitive, has too many rows of pins to allow sufficient solder paste deposition or the board is not designed for the paste-in-hole process (e.g., other components may be too close).