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The High-speed High-mix Production Environment Emerges

机译:高速高混合生产环境的出现

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The North American printed circuit board (PCB) assembly market has undergone dramatic changes since the early 1990s that have reshaped the way PCB manufacturers regard the design of their production environments. In the early part of the decade, the market consisted of two basic segments, roughly of equal proportion: OEMs, who built their own finished products, and contract manufacturers (CM), who performed that function for OEMs on a project basis. However, product lifecycles and development times then underwent a contraction while manufacturers in all markets focused on defining and limiting operations to "core competencies." As a result, the capital investment required to acquire and maintain state-of-the-art production lines became a less attractive prospect to large enterprises in the computer, telecommunications and other digitally-driven industries. Rather, their response was to allocate a greater percentage of internal resources toward research, design and product innovation; manufacturing per se was outsourced increasingly to the CMs.
机译:自1990年代初以来,北美印刷电路板(PCB)组装市场发生了翻天覆地的变化,重塑了PCB制造商对生产环境设计的看法。在这十年的早期,市场包括两个基本部分,大致相等的比例:OEM制造自己的成品,以及合同制造商(CM),后者在项目基础上为OEM履行该职能。但是,产品生命周期和开发时间随之减少,而所有市场的制造商都将精力集中在定义和限制“核心竞争力”上。结果,对于计算机,电信和其他数字驱动行业中的大型企业而言,收购和维护最先进的生产线所需的资本投资变得不那么有吸引力。相反,他们的反应是将更大比例的内部资源分配给研究,设计和产品创新。制造业本身越来越多地外包给CM。

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