Revisiting Solder Paste

摘要

Surface mount has been a critical manufacturing technology for electronics PCB assembly for more than two decades and is expected to play an important role in the foreseeable future. Consequently, solder paste will continue as the most viable interconnecting material for electronics assembly mass production. As an electronic material, solder paste is old as well as new. This is because solder paste has been around for decades. Yet its chemistry and the specific formulae have evolved. The textbook I authored in 1989 contained a comprehensive treatment of this subject (ISBN: 0-442-20754-9). With respect to solder paste, what are the changes, what will be the changes and what will not change?