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Part 1: PCB Designers Notebook — Flexible Circuit Design for SMT Assembly

机译:第1部分:PCB设计者笔记本— SMT组装的柔性电路设计

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摘要

The flexible circuit has proven to be one of the most versatile substrates for a wide range of products, even those exposed to harsh environments. These circuits traditionally have come from a rather specialized group of suppliers, but a growing number of rigid board fabricators currently are offering flexible substrate capability as well. Flex circuits rely on thin, non-reinforced films for the dielectric base layer and can be furnished with copper conductors on one or two sides. The two-sided circuit can be interconnected with plated vias typical of rigid board processing. The fabrication processes, however, can vary a great deal, depending on base material and the method for applying the copper conductor layer(s). In addition, when planning the flexible circuit for SMT the design engineer must review base material properties and thickness options. Poly-imide films are preferable and widely adopted for SMT applications, but polyester films often are selected for less demanding or price-sensitive commercial products.
机译:事实证明,该柔性电路是多种产品(即使是暴露在恶劣环境下的产品)用途最广泛的基材之一。这些电路传统上来自相当专业的供应商组,但是目前越来越多的刚性板制造商也提供灵活的基板功能。柔性电路依靠薄的非增强膜作为电介质基层,并且可以在一侧或两侧配备铜导体。双面电路可以与刚性板加工中常见的镀通孔互连。然而,取决于基础材料和施加铜导体层的方法,制造工艺可以有很大的不同。此外,在为SMT计划柔性电路时,设计工程师必须审查基础材料的特性和厚度选择。聚酰亚胺膜是优选的,并广泛用于SMT应用中,但通常选择聚酯膜用于要求不高或对价格敏感的商业产品。

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