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Part 1: Specifying Base Materials for SMT Circuit Boards

机译:第1部分:指定SMT电路板的基础材料

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To restrict the use of certain substances regarded as hazardous, the European Parliament and Council Directive have enacted the Restriction of Hazardous Substances (RoHS) Directive. A guidance document prepared by the UK-based Department of Trade and Industry (DTI) explains that the RoHS regulation bans placing any new electrical and electronic equipment containing more than a specified level of lead alloy, cadmium, mercury, hexavalent chromium and both polybro-minated biphenyl (PBB) and polybromi-nated diphenyl ether (PBDE) flame retar-dants used in plastics and circuit boards on the EU market. Tetrabromabisphenol (or TBBPA), however, remains acceptable as a flame retardant. The ban on the use of lead-alloy-bearing solders and other substances noted becomes effective on July 1, 2006.
机译:为了限制某些被认为是有害物质的使用,欧洲议会和理事会指令已经颁布了《有害物质限制(RoHS)指令》。英国贸易和工业部(DTI)编写的指导文件解释说,RoHS法规禁止放置任何新的电气和电子设备,这些设备的铅合金,镉,汞,六价铬和多溴联苯含量均超过指定水平。欧盟市场上用于塑料和电路板的氨基联苯(PBB)和聚溴二苯醚(PBDE)阻燃剂。然而,四溴双酚(或TBBPA)仍然可以用作阻燃剂。所述禁止使用含铅合金焊料和其他物质的禁令自2006年7月1日起生效。

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