Lead-Free New Problems - New Solutions

摘要

Over the past several decades the electronics assembly industry has perfected efficient and high quality manufacturing of leaded assemblies. Today we are faced with disruptive changes required by the production of Lead-Free electronics. Manufacturers are discovering that their old, tried-and-true methods no longer work. After selecting new lead-free materials and implementing new logistical systems, controlling thermal process variation is the remaining critical issue. Managing the radically different and narrow thermal process window requires fresh thinking, new procedures, and innovative technologies.