A closer look at some of the most difficult processing challenges

摘要

From the "red brick wall" of processing uncertainties as we strive to remain on the track of Moore's Law, some of the trickiest and most uncertain challenges are emerging. Consider, for example: the current and forecast state of optical lithography; two- and three-dimensional dopant profile spatial resolution needs; detecting defects associated with high-aspect-ratio structures; the reduction of water and chemicals use; and reducing the time from fab groundbreaking to first full loop wafers out to <12 months by 2008. Here we will describe these challenges and some of the potential solutions being explored.