Process and environmental benefits of HF-ozone cleaning chemistry

摘要

HF-ozone cleaning chemistry can perform the same func- tions as a conventional four-chem clean — organic removal, particle removal, chemical-oxide strip and regeneration, and metal contamination removal. This process chemistry also reduces cycle time and requires significantly less complex hardware. Properly configured HF-ozone chemistry saves cleanroom floor space and, because it uses low volumes of chemicals, it further reduces the environmental impact of semiconductor manufacturing. HF-ozone cleaning chemistry may become a method of choice for cleaning applications in single-wafer processing.