Catalytic technology for PFC emissions control

摘要

Catalytic technology offers a low-cost means of control- ling PFC emissions without impacting the semiconductor-manufacturing process. Greater than 99% destruction of C_1 to C_4 PFCs can be achieved at temperatures of 650-700℃, while PFCs such as NF_3 and SF_6 can be destroyed at significantly lower temperatures using a novel PFC abatement catalyst. Laboratory and field studies demonstrate that the catalyst is stable, with the ability to maintain high destruction efficiency for an extended period of time. Although stable, the presence of SiF_4 in the feed stream poisons the catalyst, necessitating that it be scrubbed upstream of the catalyst bed. Cost of ownership analysis indicates that a catalytic PFC abatement process can treat PFC emissions from etch and CVD tools for $0.20-0.25/wafer.