The 2300 Etch Series is an advanced etch product line for both 200mm and 300mm wafers. The Exelan Dielectric 2300 etch system brings the benefits of dual-frequency, confined plasma technology into 300mm. The technology is currently used in volume production for a range of applications, including copper damascene, low-k, spacer, contact, via, and in situ hardmask open. The flexibility of the Exelan allows the integrated, in situ photoresist strip and barrier removal required for advanced copper damascene. The Versys Silicon 2300's large process window allows for high performance at sub-130nm. The system offers the broadest portfolio of proven 130nm processes for production, including advanced gate BARC, resist trim, hardmask open, and STI, in the same chamber.
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