This production-ready, I300I-compliant 300mm wafer inspection tool is fully automated and can run multiple wafer sizes without mechanical changeover, an important consideration for manufacturing environments scaling from 200mm to 300mm and for foundries where frequent wafer size changes are common practice. Based on the proven NSX series, the new system combines automated 300mm wafer handling, factory hardware, and software interface capabilities with the inspection technology of the NSX, providing chipmakers with a complete high-speed inspection solution for 300mm production.
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