Chip singulation process with a water jet-guided laser

Bernold Richerzhagen

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Chip singulation process with a water jet-guided laser

机译：水射流引导的激光切单工艺

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摘要

A novel method for dicing wafers with a laser beam guided by total internal reflection in a water jet is described. A significant benefit is the reduction of chipping and imperfections at the edge of the singulated chips.

机译：描述了一种通过在水射流中通过全内反射引导的激光束切割晶片的新颖方法。一个显着的好处是减少了切单的芯片边缘的碎裂和瑕疵。

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《Solid state technology》 |2001年第4期|p.S25-S28|共4页
作者
Bernold Richerzhagen;
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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类一般性问题;
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入库时间 2022-08-18 01:37:00

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Chip singulation process with a water jet-guided laser

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