Metal deposition in power semiconductors

摘要

Among transistor manufacturers, perhaps the main measure of technical excellence is RDS_(ON), the resistance of the transistor in its on state. This value needs to be as low as possible to improve current carrying capability, and to minimize power consumption. There are multiple ways of reducing RDS_(ON): thick interconnect layers, smaller pitch―that also benefits die size and cost ― and thinner wafers. All these techniques tend to be used to a greater or lesser extent.