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USJ sheet resistance

机译:USJ薄层电阻

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摘要

A new method using elastic-material (EM) probes to form nonpenetrating contacts to the silicon surface to measure the four-point probe (4PP) sheet resistance of USJ source/drain structures is described. Sheet resistance measurements on USJ implanted p+In structures with SIMS junction depths as shallow as 15nm have been observed, with values obtained by EM probe consistent with expectations.
机译:描述了一种新的方法,该方法使用弹性材料(EM)探针形成与硅表面的非穿透接触以测量USJ源/漏结构的四点探针(4PP)薄层电阻。已经观察到在SIMS结深度浅至15nm的USJ注入的p + In结构上的薄层电阻测量,EM探针获得的值与预期一致。

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