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Taking the wet-developable route to applying BARC in implant layers

机译:采取可湿显影的方法将BARC应用于植入物层

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摘要

Traditionally, bottom antireflective coatings (BARG) have mainly been used in critical layers for gates and contacts, but the application of BARC in implant layers also has become more desirable as device feature sizes shrink. Using BARC in implant layers promises greater tolerance for reflective notching and CD variations when wafer topography becomes smaller, but the feasibility of traditional dry-etch coatings is questionable due to process complexity, defectivity, and the potential for substrate damage. A wet-developable BARC tailored for implant layers promises to overcome these barriers.
机译:传统上,底部抗反射涂层(BARG)主要用于栅极和触点的关键层中,但是随着器件特征尺寸的缩小,BARC在注入层中的应用也变得更加可取。当晶片形貌变得更小时,在注入层中使用BARC可以更好地容忍反射凹口和CD变化,但是由于工艺复杂性,缺陷性和潜在的基板损坏,传统干法蚀刻涂层的可行性值得怀疑。专为植入物层定制的可湿显影的BARC有望克服这些障碍。

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