Advanced techniques for 3D devices in wafer-bonding processes

摘要

Wafer bonding is one of the most powerful processing techniques used in the fabrication and packaging of MEMS devices, which usually have three-dimensional architectures. Different approaches are currently in use: fusion, adhesive, eutectic, thermal-compression bonding (normally used for device fabrication and generation of 3D structures), and anodic bonding (the most used wafer-level packaging procedure). An overview of advanced techniques - in particular, the bonding of multiple wafers (triple stack bonding) and interface materials for high-vacuum compatible bonds -is presented.