The effects of wet-etch parameters on wafer-thinning etchants

摘要

Designed experiments determine the effects of wet-etch parameters on the performance of several different types of wafer-thinning etchants. Based on the use of a single-wafer spin-processor for 200mm wafers, the studies investigate the effects of temperature, chuck speed, flow rate, and dispense profile on etch rates, etch uniformity, and surface roughness during wafer-thinning process steps.