The thin-film landscape for ALD processing

摘要

Different manufacturing requirements for major IC device types call for different thin-film material requirements. Current materials limitations call for higher performing materials solutions. Some incumbent deposition technologies may be extended only to be replaced by ALD at a future insertion node, as driven by device structure and physics needs. Some single-wafer processes will transition to batch platforms and the emergence of "CVD-like ALD" will fill out the process space.