Automated wafer packing/sorting system

摘要

The WPC EVO wafer handling/packing/ unpacking machine is a next-generation 300mm tool that provides the capability to fully automate wafer packing, unpacking, and sorting processes between industry standard cassettes, FOUP/FOSB and horizontal wafer shippers. The machine completely manages the logistics process (100% traceability), can handle full range (thick or thin) wafer handling, and operates in a fully automated environment, with SECS/GEM300 Standard.