Many emerging wafer bonding technologies are requiring higher applied force for successful wafer level encapsulations. Pneumatic and hydraulic systems have both been used to apply force in wafer bonding equipment, however, the pneumatic approach, otherwise known as "pressure column," has the benefits of extreme uniformity, lower cost-of-ownership, and higher reliability compared to hydraulic systems. These benefits are necessary to realize 300mm metal based bonding and high modulus materials integration on the wafer scale.
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