SiP and SoC will remain co-existing system solutions

摘要

System-in-package (SiP) and system-on-chip (SoC) approaches provide different advantages for different end-market applications. SiPs allow for relatively easy hetero-integration of analog and RF functionalities with digital CMOS, with possible cost and performance benefits. However, proper system partitioning at the design stage is key to obtaining the maximum value from a SiP. SoCs provide the lowest manufacturing cost, but design costs are often higher and time-to-market is generally slower. Depending on the anticipated unit volumes and target ASPs for the required system, either approach may be desirable.