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New Tool Takes On Flicker Noise

机译:新工具产生闪烁噪声

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Cascade Microtech has unveiled a new test system designed to measure flicker noise in ICs, seen as a barrier to lowering device operating voltages as geometries shrink-and a strategic initiative to integrate measurements systems to provide users with measurement accuracy assurance.rnFlicker (l/f) noise, which occurs in all semiconductors, can compromise device performance by causing jitter or phase noise in communications devices (resulting in high bit-error rates), or random retention errors in flash memory or soft errors in SRAM. At smaller geometries, flicker noise has become a key contributor to overall noise in high-performance devices-in 2003, the ITRS amended a previous observation by reporting that operating voltages actually increase as device geometries shrink. Flicker noise is the gating barrier to reducing device operating voltages, so accurately characterizing it is increasingly urgent. (And today's market pressures allow even less room for the types of performance degradation flicker noise can cause: Higher serial data rates means less jitter margin, and the low standby power demanded by handhelds results in lower signal-to-noise ratios.)
机译:Cascade Microtech推出了一种新的测试系统,旨在测量IC的闪烁噪声,这被视为随着几何尺寸的缩小而降低器件工作电压的障碍-以及一项集成测量系统以为用户提供测量精度保证的战略举措。在所有半导体中产生的噪声会在通信设备中引起抖动或相位噪声(导致高误码率),闪存中的随机保留错误或SRAM中的软错误,从而损害设备性能。在较小的几何结构中,闪烁噪声已成为高性能设备整体噪声的关键因素-2003年,ITRS修正了先前的观察,报告说工作电压实际上随着器件几何结构的缩小而增加。闪烁噪声是降低器件工作电压的门控障碍,因此准确表征其特性变得越来越紧迫。 (当今的市场压力为闪烁噪声可能导致的性能下降类型提供了更少的空间:更高的串行数据速率意味着更少的抖动裕度,而手持设备所需的低待机功耗导致更低的信噪比。)

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  • 来源
    《Solid state technology》 |2008年第7期|22|共1页
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  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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  • 入库时间 2022-08-18 01:35:30

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