Deposition technology for TFT-LCD production savings

摘要

A flat panel deposition technology, which utilizes a rotary target arrangement instead of the traditional planar and is also applicable beyond Gen 8.5, is described. In addition to enabling manufacturing and materials cost reductions in pre-sputter qualification, target consumption is reduced and data is presented showing that thickness uniformity, sheet resistivity, and target erosion profiles comply with Gen 8.5 TFT requirements.