Multilayer thin film barrier for protection of flex-electronics

摘要

Continuous evolution marks the electron- ics industry's progress toward even thinner, lighter and more flexible products. Although tremendous progress has been demonstrated, one fundamental obstacle that remains is the sensitivity of these electronics to the moisture and oxygen in the environment. So the search for an inexpensive, yet robust method to protect these devices continues. The current conventional encapsulation solutions, e.g., using a metal can or glass can with desiccant, although somewhat effective, add weight, thickness and cost. Therefore, a thin film barrier is viewed as the only viable solution to protect these devices from damage caused by moisture and oxygen while maintaining a thin and flexible form factor and light weight.