A new Microelectronics Innovation Center is being formed at the Universite de Sherbrooke in Bromont, Quebec (cofounded by DALSA and IBM Canada) to focus on 200mm MEMS and 3D wafer-level packaging.rnShin-Etsu Chemical has joined SEMA-TECH's Resist Materials and Development Center (RMDC) in Albany, NY, to develop EUV photoresist for <22nm nodes.rnSuss MicroTec says it has installed a LithoPack300 lithography cluster at a Japanese customer.
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机译：新的微电子创新中心正在魁北克布罗蒙特的舍布鲁克大学成立（由DALSA和IBM加拿大共同创立），专注于200mm MEMS和3D晶圆级封装。信越化学已加入SEMA-TECH的Resist Materials and Development纽约州奥尔巴尼市的Center（RMDC）为小于22nm的节点开发EUV光致抗蚀剂。rnSussMicroTec表示已为日本客户安装了LithoPack300光刻设备。
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