Thin films for 3D: ALD for non-planar topographies

摘要

Extreme and non-planar substrate topographies that provide challenges for conventional thin film deposition techniques are abundant. Such applications span the range of structures from DRAM trench cells and MEMS devices to coatings of esoteric materials such as aerogels, viruses, nanotubes, microlenses, piping, grains and particles, and even porous dental material. For these types of important and interesting applications, atomic layer deposition (ALD) provides an exceptional technology for overcoming such challenges in order to achieve superior film uniformity, step coverage, and film conformality.