28nm tapeouts proceeding according to plan

摘要

Toppan Printing Co. Ltd. has established a new photomask manufacturing process at its photomask facility in Asaka, Japan, to support 32nm and 28nm semiconductor device production, through an ongoing joint development project with IBM. Photomasks produced at this site are compatible with those produced at IBM's photomask facility in Essex Junction, VT, and have been qualified by IBM.rn"We now have the final toolkit and have done the fine-tuning of the process in Burlington," Franklin Kalk, CTO at Toppan Photomasks, told SST. 32nm test chips are already being taped out, and by 2H09 and into 1H10, "numerous customers will be ready for production tapeout for 32nm bulk CMOS," he said. Bulk CMOS 28nm test chips for logic are anticipated to proceed in 1H10 with bulk production taking place in 2H10. "There is strong pull for this technology," which Kalk finds encouraging.