Megasonic cleaning tool seeks a clean sweep at 65nm and below

摘要

At advanced technology nodes (65nm and below) there is a need for cleaning technology that better manages the ever-shrinking cleaning process window. Mechanical damage and defect levels - particu-rnlarly gate and capacitor structures that become increasingly fragile - becomernmore challenging with each node. It's this sweetspot that ACM Research Shanghai Ltd. is targeting with its new Ultra C 300mm single-wafer megasonic cleaning tool, which debuted at SEMICON China in March.