For the most part, the universes of wafer probes and sockets have customarily been separate and distinct. Yet they parallel each other in many ways: they provide temporary electrical contact to a device under test, and have many common technical challenges such as contact resistance, signal integrity, tight pitch, and cleaning, among others.rnDespite similarities, it is uncommon to find engineers, suppliers, or test organizational structures involved with both. For example, there are probe engineers and there are socket engineers; probe suppliers and socket suppliers; and wafer test tooling, operations, and techniques, and those for package test. Even the languages of probe and sockets can differ. Jim Brandes, product manager at socket supplier Everett Charles Technologies, cited an example where in probes "overdrive" is the term, whereas in sockets it is "compliance".rnHowever, driven by the trend toward wafer-level packaging (WLP), where the package is fabricated alongside the wafer, distinctions between the two universes are diminishing.
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机译：在大多数情况下，晶圆探针和插座的领域通常是相互独立的。然而，它们以多种方式彼此并联：它们提供与被测设备的临时电接触，并且面临许多常见的技术挑战，例如接触电阻，信号完整性，紧密间距和清洁等。尽管有相似之处，但这种现象并不常见。寻找工程师，供应商，或测试涉及两者的组织结构。例如，有探针工程师和插座工程师。探头供应商和插座供应商；晶圆测试工具，操作和技术，以及用于封装测试的工具。甚至探针和插座的语言也可能不同。插座供应商Everett Charles Technologies的产品经理Jim Brandes举了一个示例，其中探针中的“过载”是术语，而插座中的是“合规”。然而，受晶圆级封装（WLP）趋势的推动，该封装是在晶圆旁边制造的，这两个世界之间的区别正在减小。
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