USA

摘要

IBM, Applied Materials, and the U. of Albany are jointly developing process modeling for 22nm finFETs.rnTela Innovations has acquired Blaze DFM, adding power optimization to its own layout optimization capabilities.rnIBM and PDF Solutions are developing a software/design IP platform focused on chip scaling by "design co-optimization."rnBrion has added specs for Cymer lasers to its computational lithography modeling.rnWacker Chemie AG plans build $1B polysilicon plant in Bradley County, TN.rnIBM will fab Ramtron's 0.18um FRAMs at its Burlington, VT site.rnAxcelis is selling its 50% stake in a Japanese JV to partner Sumitomo Heavy Industries,rnand will use some of the cash to pay off defaulted notes.