The Technomics Of 22nm

摘要

What is the most viable path to enabling the design shrink to 22nm? Will a solution emerge that overcomes the technical and economic hurdles currently being anticipated in both manufacturing and design? EUV is still facing substantial technical and economic uncertainties, and multiple challenges must be overcome to enable 22nm production with 193nm wavelength immersion lithography systems. With little help available from scanner optics, the industry faces the high mask cost and scanner throughput penalties of double patterning. Restrictive design rules (RDRs) could help solve the litho problem, but RDRs constrain IP migration and place strict limitations on designers, which will extend design cycles, limit creativity, and ultimately impact design cost and time-to-market.