The Case For Integration

摘要

The limits of traditional CMOS scaling are at hand, combined with an unprecedented financial crisis in the electronics industry. It's too early to tell how it will all play out, beyond an extreme focus on cutting costs, but it's clear that work will continue on a new generation of device architectures and electronic materials that will support a continued drop on cost per function. As noted in the International Technology Roadmap for Semiconductor (ITRS), as traditional Moore's law scaling becomes more difficult, assembly and packaging innovation that enables functional diversification and allows scaling in the third dimension is taking up the slack.