Process equipment readiness for through-silicon via technologies

摘要

Leading-edge applications are employing through silicon vias (TSVs) to satisfy the demand for devices to deliver more functionality faster in smaller dimensions, especially as consumer electronics become increasingly complex, compact, and energy efficient. In homogeneous or heterogeneous integration, similar or different chips are stacked top of each other and joined by vertical interconnects. Today, unit processes are ready and integration is well advanced, with "best known methods" for typical interposer, via middle, and via last flows ready for limited pilot production at several locations.