Holistic substrate inspection for defects at the 32nm node and beyond

摘要

Systematic inspection of the front-side, back-side and edge of substrates is becoming more critical - both to provide holistic, 360-degree wafer inspection as well as to increase the productivity and return on investment from today's multi-billion-dollar fabs. Holistic inspection needs will only increase as the industry continues to drive toward greater cost efficiencies by increasing substrate sizes beyond 300mm diameters to 450mm. This article describes holistic inspection methodology.