Macrodefect inspection for 3D packages The NSX 320 automated macro defect (>5um) inspection system targets 3D advanced packaging processes such as through-silicon vias (TSV), providing critical inspection capabilities for edge trimming metrology, wafer alignment during bonding processes, sawn wafers on film frames, and other TSV-related processes. It incorporates the company's XSoft2 software including high-speed staging, on-the-fly image capture, and a range of sensor and objective options. Features include critical dimension measurement, 3D sensors for TSV depth or bump metrology, and the ability to flip wafers to allow inspection of both front and back surfaces. Rudolph Technologies,
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