Packaged IC component inspector

摘要

The ICOS CI-T620 is a fully automated optical inspector of IC packages for 3D measurements and package quality, with dual tapers for improved output. Devices are brought to the inspection module with 14 nozzles, with automatic pitch changeover; a camera measures the tray dimensions/ tolerances and compensates for flex in the tray. Capabilities include 3D metrology inspection down to 5μm, <5min package changeover, and improved inspect-ability of surface defects and micro-cracks down to 40μm.