TSV metrology system

摘要

The FilmTek 2000M metrology system simultaneously measures critical dimension, etch depth, and film thickness for TSV and MEMS struc- tures. It can determine TSV etch depth for via structures with diameters ranging from 1-100μm, up to a maximum etch depth of 500μm, with CD precision (la) <0.2%, etch depth precision (la) <0.3%, and film thickness precision (la) <0.005%. Measurement time is 3-8 sec per point.