The WS 3880—a replacement for the 3840 system, from Rudolph's acquisition of RVSI assets in 2008—provides critical inspection and measurement capability (randomly sampled or 100% inspection) for advanced packaging applications: micro and standard bumps, through silicon via (TSV) post-via-fill copper protrusions (nails), and re-distribution layers (RDL) used in 3D IC packaging. The base system provides high-throughput, image-based macro defect inspection, as well as measurements of bump diameter and position, RDL width, and other 2D parameters.
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