Led by Qualcomm, Broadcom, AMD, Nvidia and Marvell, fabless companies are quickly evolving, developing high performance, low power products in tablets, smartphones, and ultrabooks. Foundries, led by TSMC, UMC, GLOBALFOUNDRIES and SMIC, are racing to meet their needs, pushing into the 22nm technology node and more advanced types of packaging, including 3D integration.
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