MEMS packaging growth, trends, and special requirements

摘要

The MEMS packaging sector is growing 2x faster (-20% CAGR) by unit shipments than the larger IC packaging industry, shows Yole Developpement in its report "MEMS Packaging." Wafer level packaging (WLP) and through-silicon via (TSV) technologies will see the fastest growth, with leadframe and organic laminate-based packages hitting 16% CAGR over the next 5 years.