Advanced packaging in the new decade

摘要

In the last decade, advanced packaging has emerged as an enabler of today's electronic products. The impact of packaging, assembly, and test is increasingly felt in the semiconductor industry and package selection is important to the success of the end product. The industry has seen a package evolution in the past 10 years and the road ahead may require a package revolution. Issues for future packaging include handling and assembly of devices with low-k and ultra low-k dielectrics, especially with Pb-free bumps and fine pitch bumps such as copper pillar. When the first low-k wafers were shipped from the foundry to assembly houses, the same assembly processes and materials were used. No one realized that stresses in the assembly process would cause delamination within the IC structure that would result in reliability problems causing devices to fail. Because no one gave much thought to the assembly process, companies missed revenue shipments. Assembly and packaging houses scrambled to study the problem and eventually made process changes and adopted new formulations of materials such as underfill and mold compounds.