The Tachyon Flexible Mask Optimization (Tachyon FMO) system, from Brion Technologies, a division of ASML, enables use of multiple optical proximity correction (OPC) techniques in a single mask tapeout for 2Xnm lithography processes. With Tachyon FMO, chip makers can use advanced and computationally intensive OPC in localized areas for maximum benefit. This can help reduce tapeout cycle time by two-thirds from competitive technologies. Tachyon FMO uses what they call "boundary healing" to allow different parts of a design to use different correction techniques without inducing hotspots in the boundary regions. Brion's technology detects and manipulates hotspots, reinserting corrected hotspots into the full chip design without introducing new defects due to proximity effects of neighboring patterns.
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