3D integration: not a windfall for test

摘要

After a seemingly interminable run of being "a year away," it is clear that 3D integration (or at least the silicon-interposer-enabled 2.5D version) now offers a viable path to achieve the performance, cost, and feature integration required of next-generation mobile devices. As with any significant shift in process technology, a redistribution of the value provided by different semiconductor supply-chain elements is likely here, along with a corresponding shakeup of the winners and losers in the supply chain.