Measuring metals, dielectrics, resists and CDs in advanced packaging

Kim Cheolkyu

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Measuring metals, dielectrics, resists and CDs in advanced packaging

机译：测量高级包装中的金属，电介质，抗蚀剂和CD

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来源
《Solid state technology》 |2017年第6期|27-31|共5页
作者
Kim Cheolkyu;
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作者单位

Rudolph Technol Inc, Metrol Prod Management, Flanders, NJ 07828 USA;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
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1. A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing [J] . K.-F. Becker, T. Braun, A. Neumann, Journal of Electronic Packaging . 2005,第1期

机译：晶圆级封装的新方法：封装制造中先进系统的封装，金属化和激光结构
2. Resistive switching in TiO_2-based metal-insulator-metal structures with Al_2O_3 barrier layer at the metal/dielectric interface [J] . B. Hudec, A. Paskaleva, P. Jancovic, Thin Solid Films . 2014,第jula31期

机译：在金属/电介质界面处具有Al_2O_3势垒层的TiO_2基金属-绝缘体-金属结构中的电阻切换
3. The role of conduction electrons in the formation of thermal boundary resistance of the metal-dielectric interface and resistivity of metal films, at low temperatures [J] . Bezuglyj A. I., Shklovskij V. A. Low temperature physics: Simultaneous Russian - English publication . 2016,第8期

机译：传导电子在低温下形成金属-电介质界面的热边界电阻和金属膜的电阻率的作用
4. Fine tuning of negative photo-resist sidewall profiles for thick metal lift-off in applications of MEMS and advanced packaging [C] . 2010 12th Electronics Packaging Technology Conference . 2010

机译：负光刻胶侧壁轮廓的微调，可用于MEMS和高级封装应用中的厚金属剥离
5. Reliability of advanced dielectrics in gate oxide and device level packaging in MEMS. [D] . Rahman, Mohammad Shahriar. 2009

机译：栅极氧化层和MEMS器件级封装中高级电介质的可靠性。
6. An Investigation of Polyoxometalate Hybrid Materials as Patternable Dielectrics and Lithographic Resists [O] . Brandon Hardie, Mark Roll 2017

机译：多金属氧酸盐杂化材料作为可图案化电介质和光刻胶的研究
7. A new method developed in measuring the dielectric constants of metallic nanoparticles by a microwave double-cavity dielectric resonator [O] . Liu J.H. 2011

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8. Production Engineering Measure for Capacitor Vaporized Teflon, Metallized Glow-Discharged Deposited Dielectric Film [R] . McConnell, A. M. 1964

机译：电容器汽化聚四氟乙烯，金属化辉光放电电介质薄膜的生产工艺措施

Measuring metals, dielectrics, resists and CDs in advanced packaging

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