3D progress seen at SiP global summit

摘要

The SiP global summit was held during 2011 Semicon Taiwan in Taipei. It consisted of the 3D IC Test Forum "Test Challenges and Solution in the New Era of Heterogeneous Integration/' chaired by Mike Liang, President and CEO, KYEC; the 3D IC Technology Forum, "Embracing the Era of 2.5D & 3D ICs," chaired by Dr. Ho-Ming Tong, GM and chief R&D officer, ASE Group; and the Embedded Substrate Forum, "Bridging the Last Mile of Heterogeneous Integration," chaired by Dr.