What's driving MEMS commercialization

摘要

Packaging and test are acknowledged as major cost and performance factors in the creation of a MEMS device. To meet the need of the industry, a number of MEMS packaging suppliers have been created. Another very interesting aspect of MEMS packaging is quickly emerging. . .that of wafer level packaging, chip stacking and TSV Now many MEMS foundries are offering this capability with wafer "capping" being a mainstay of MEMS for many years.