Is 3D packaging where it needs to be?

摘要

Eric Strid of Cascade Microtech revealed that the company is producing lithographically printed probe cards by MEMS techniques capable of 6μ?? sq. ? 20μ?? high probe tips on 40μ?? pitch for testing dense 3D IC pads. "Such technology allows scalability to lower cost and finer pitches," he said, adding that these probe cards "are being sold in research quantities." Standard pad locations are required for vendor interchangeability, and "standard materials specs for pads...