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Optimization of 0.18 μm CMOS devices by coupled process and device simulation

机译:通过耦合工艺和器件仿真优化0.18μmCMOS器件

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Coupled process and device simulation is applied for the optimization of the doping in 0.18μm CMOS transistors. An advanced device architecture with a pocket type doping around the source/drain extensions was assumed to reduce the short channel effects. Two optimization targets were considered: the drain drive current at a fixed leakage current and a special figure of merit which characterizes the maximum switching frequency of the transistors. The method of response surface modeling was used to find the optimum conditions for the critical implantation steps which form the doping distribution in the active areas of the transistors. The simulation results show that an increase of the implantation dose of the source and drain extensions to values of 5 x 10~14-10~15 cm~-2 improves both the drain drive current and the maximum switching frequency of the transistors. A three-dimensional simulation of the narrow channel transistors shows a significant non-uniformity in the lateral current distribution with the current maximum located at the edges of the active area of such transistors.
机译:耦合的过程和器件仿真被用于优化0.18μmCMOS晶体管中的掺杂。假设采用先进的器件架构,在源极/漏极扩展区周围采用口袋型掺杂,以减少短沟道效应。考虑了两个优化目标:在固定泄漏电流下的漏极驱动电流和表征晶体管最大开关频率的特殊品质因数。使用响应表面建模的方法来找到关键注入步骤的最佳条件,这些关键注入步骤会在晶体管的有源区中形成掺杂分布。仿真结果表明,将源极和漏极扩展区的注入剂量增加到5 x 10〜14-10〜15 cm〜-2可以同时改善晶体管的漏极驱动电流和最大开关频率。窄沟道晶体管的三维仿真显示,横向电流分布存在明显的不均匀性,最大电流位于此类晶体管的有源区域的边缘。

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