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Front-end process simulation

机译:前端流程模拟

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摘要

If the 1980 were the decade in which two-dimensional (2-D) device simulation became widely used for device design, the 1990s saw the widespread adoption of 2-D process simulation. Physics-based models of such processes as ion channeling, transient enhanced diffusion and surface dopant loss, coupled with much faster workstations and large memories, have put predictive capability on process engineer's desktops. Sophisticated modeling strategies combined with focused experiments have led to the improved physical understanding of dopant implantation, diffusion and activation. A hierarchy of tools, from ab-initio electronic structure calculations, through Monte Carlo diffusion simulators, to the continuum models which are the mainstay of process design, have been applied. The implications of some of these newly discovered phenomena are analyzed in a number of applications in advanced technologies.
机译:如果说1980年是二维(2-D)设备仿真被广泛用于设备设计的十年,则1990年代见证了二维过程仿真的广泛采用。基于物理的过程模型,例如离子通道,瞬态增强扩散和表面掺杂物损失,再加上更快的工作站和大容量内存,已将预测能力置于过程工程师的桌面上。复杂的建模策略与重点实验相结合,已经提高了对掺杂剂注入,扩散和激活的物理理解。从ab-initio电子结构计算到Monte Carlo扩散仿真器,再到作为过程设计主体的连续模型,已经采用了一系列工具。在先进技术的许多应用中,分析了其中一些新近发现的现象的含义。

著录项

  • 来源
    《Solid-State Electronics》 |2000年第5期|863-868|共6页
  • 作者

    C.S. Rafferty;

  • 作者单位
  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 一般性问题;
  • 关键词

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